Embedded Electronics

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The solid-state nature of Fabrisonic’s UAM bond allows for of all manner of wires, fibers, and sensors into a metallic substrate. Since the metals do not have to be heated for bonding aluminum alloys can be welded with peak temperatures below 250 F.   At such low temperatures sensors, communication circuits, and actuators can be [...]

Made in Central Ohio

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Fabrisonic and our patented Metal 3D printing technology were highlighted today in Columbus Business First.  The article highlighted other Columbus companies such as Komar Industries and Columbus giant Worthington Industries.  The author focused on the unique capabilities to grow companies via technology development.  Fabrisonic agrees that Columbus is great place for technology innovation.  Non-profit research [...]

UAM Users Group

This week leading researchers from around the world gathered at Fabrisonic for the first annual UAM users group.  Researchers representing six universities and three countries met to discuss developments in ultrasonic additive manufacturing.  Participating research groups included: The Ohio State University Loughborough University Centre de métallurgie du Québec University of Tennessee University of Delaware University [...]

Fabrisonic Interview from Manufacturing Engineering


Sarah Webster, from Manufacturing Engineering Media, stopped by Fabrisonic’s both at RAPID 2014 last month.  Fabrisonic President, Mark Norfolk, was interviewed about our metal 3D printing technology.  The video includes information about the metallic properties, our hybrid process, customization for customers and much more. Click HERE for the direct link, or go to YouTube and [...]

Fabrisonic Noticed in Machine Design

During the Rapid 3D printing trade show this month, Fabrisonic was noticed by Machine Design. Included with a picture of a titanium/aluminum metal matrix composite, there was a short excerpt of what Fabrisonic can do for their customers.  For the direct link, click HERE. The trade show was a wonderful experience for networking and meeting [...]

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